SLA ILLINOIS CONFERENCE STIPEND APPLICATION AND GUIDELINES
The Illinois Chapter of the Special Libraries Association had the largest increase in membership in 2007 and has been awarded a free conference registration as a result! The Illinois Chapter is going to combine this free conference registration with a travel stipend and award it to a member who has been in the field of librarianship for 10 years or more to help cover expenses for the 2008 SLA Annual Conference in Seattle, June 15 - 18. The chapter will select one member from qualified applicants to receive a $1,200 award.
ELIGIBILITY
- Applicants must have 10 or more years experience in special librarianship.
- is intended for individuals whose organizations do not support conference attendance.
- Applicants must be members of SLA by the time they have submitted their application.
- The recipient may not accept a travel award for the annual conference from any other SLA Division or Chapter.
APPLICATION PROCEDURES
- Prepare a written statement, in English, of approximately 500 words on why you would like to attend the conference, i.e., anticipated benefits of conference attendance.
- Include a letter of recommendation from an immediate supervisor or an past or present Illinois Chapter Board member.
- Include a resume.
POST CONFERENCE REQUIREMENTS
- The recipient will be required to write an article for the SLA-Illinois Informant newsletter.
- The recipient will be required to volunteer for a local SLA committee.
- All applicants will receive notification of award status by the end of March 2008.
- Winners will receive half of the stipend in March 2008 and the second half when the article for the Informant is submitted.
Submit the application materials, along with your address, telephone number, email address (if applicable) via regular mail or email to:
Jane Candela
Packer Engineering, Inc.
1950 N. Washington St.
Naperville, IL 60563
jcandela@packereng.com [0]
No phone calls, please.)
(Submissions by regular mail must be postmarked no later than March 14, 2008. Emailed submissions must be received by 5 p.m. March 14, 2008.)